INVITATION

EXMATEC 2008 is the continuation of successful, biannial meetings, previously held in Lyon, Parma, Freiburg, Cardiff, Heraklion, Budapest and Cadiz. Contributions fall within the scope of EXMATEC as long as they treat issues of material fabrication, characterization and processing of compound semiconductors. Works on devices are also appropriate in this context. The central topics are development, improvement and application of new and advanced methods in the fabrication and evaluation of compound semiconductor materials and structures to develop understanding of the interrelationship between structural, electrical and other material properties and device characteristics, such as performance, reliability, reproducibility, lifetime, yield, etc. The conference topics apply to all compound semiconductor materials, related structures and processing.

TOPICS

Appropriate topics include, but are not necessarily limited to the following:

• Substrates, bulk and surface properties, annealing, post growth treatment, growth control and assessment.
• Epi-layers, ion implantation, wafer bonding, band gap engineering, growth control and assessment, role of buffer layers, selective deposition, hydrogenation, etc.
• Control of interfaces, surface structure, substrate pre-processing, vertical structures, lattice mismatch.
• Narrow and intermediate gap III-V, II-VI based compound materials and devices.
• Wide gap IV-IV, III-V and II-VI, Si-Ge and similar materials and devices.
• Quantum dots, low dimensional structures, other nanostructures.
• Fabrication, modelling and evaluation of compound microelectronic mechanisms.
• Reliability, physics of failure and characterization of degradation mechanisms.
• Monitoring, characterization, use of statistical process control techniques.
• Process, epitaxy, issues, intermediate products and fully processed devices.
• Instrumentation, standardization, innovative and improved characterization techniques.

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